Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
半导体器件 - 第14-3部分:半导体传感器 - 压力传感器

2009-04-29

半导体器件 第14-3部分: 半导体传感器-压力传感器
Semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors

2006-08-23

Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
半导体器件 - 第14-5部分:半导体传感器 - Pn结半导体温度传感器

2010-02-11

Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
半导体器件 - 第14-1部分:半导体传感器 - 传感器的通用规范

2010-01-21

반도체 소자 — 제14-1부: 반도체 센서 —센서의 일반 규격
半导体器件 - 第14-1部分:半导体传感器 - 传感器的通用规范

2019-12-31

반도체 소자 — 제14-1부: 반도체 센서 — 센서의 일반 규격
半导体器件第14-1部分:半导体传感器传感器总规范

2021-12-29

IEC 60747-14-5. Semiconductor devices. Discrete devices. Part 14-5. Semiconductor sensors. PN-junction semiconductor temperature sensor
IEC 60747-14-5 半导体器件 离散设备 第14-5部分 半导体传感器 PN结半导体温度传感器

2007-04-19

BS IEC 60747-14-3. Semiconductor devices. Part 14-3. Semiconductor sensors. Pressure sensors
BS IEC 60747-14-3 半导体器件 第14-3部分 半导体传感器 压力传感器

2008-04-22

BS IEC 60747-14-1. Semiconductor devices. Part 14-1. Semiconductor sensors. Generic specification for sensors
BS IEC 60747-14-1 半导体器件 第14-1部分 半导体传感器 传感器总规范

2008-04-22

Semiconductor devices - Part 14-10: Semiconductor sensors - Performance evaluation methods for wearable glucose sensors
半导体器件.第14-10部分:半导体传感器.可穿戴葡萄糖传感器的性能评估方法

2019-11-13

반도체소자 — 제14-10부: 반도체센서 — 부착 삽입형 혈당 센서의 성능 평가 방법
半导体器件.第14-10部分:半导体传感器.可穿戴葡萄糖传感器的性能评估方法

2022-11-22

半导体器件 第14-1部分: 半导体传感器-总则和分类
Semconductor devices Part 14-1: Semiconductor sensors - General and classification

2006-08-23

Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
文件草稿-半导体器件-第14-5部分:半导体传感器-PN结半导体温度传感器（IEC 47E/353/CD:2007）

2008-03-01

Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
半导体器件.第14-11部分:半导体传感器.测量紫外线、照明和温度的基于表面声波的集成传感器的试验方法

2021-03-03

Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件14.半导体器件的机械标准化.第2部分:尺寸

2006-07-17

Semiconductor devices - Part 18-2: Semiconductor bio sensors - Evaluation process of lens-free CMOS photonic array sensor package modules
半导体器件.第18-2部分:半导体生物传感器.无透镜CMOS光子阵列传感器组件的评估过程

2020-02-07

Semiconductor devices - Part 19-2: Smart sensors - Indication of specifications of sensors and power supplies to drive smart sensors for low power operation
半导体器件第19-2部分:智能传感器驱动智能传感器低功耗运行的传感器和电源规范的指示

2021-05-21

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
半导体器件汽车半导体接口第2部分:汽车传感器共振无线电力传输效率评估方法

2018-03-08

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors (IEC 62969-2:2018); German version EN IEC 62969-2:2018
半导体器件.汽车用半导体接口.第2部分:汽车传感器用谐振无线功率传输的效率评估方法（IEC 62969-2-2018）；德国版本EN IEC 62969-2:2018

2018-09-01