首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 IEC 63150-1:2019
到馆阅读
收藏跟踪
购买正版
Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 1: Arbitrary and random mechanical vibrations 半导体器件.实际振动环境下动能收集装置的测量和评定方法.第1部分:任意和随机机械振动
发布日期: 2019-05-10
IEC 63150-1:2019规定了一维机械振动动能收集装置的术语、定义和试验方法,以确定实际振动环境下的特征参数。此类振动能量收集设备通常具有其自身的非线性机制,以在宽带频率范围内有效捕获振动能量。本文件适用于具有不同发电原理(如电磁、压电、静电等)且对外部机械激励具有不同非线性行为的振动能量收集装置。
IEC 63150-1:2019 specifies terms and definitions, and test methods for kinetic energy harvesting devices for one-dimensional mechanical vibrations to determine the characteristic parameters under a practical vibration environment. Such vibration energy harvesting devices often have their own non-linear mechanisms to efficiently capture vibration energy in a broadband frequency range. This document is applicable to vibration energy harvesting devices with different power generation principles (such as electromagnetic, piezoelectric, electrostatic, etc.) and with different non-linear behaviour to the external mechanical excitation.
分类信息
关联关系
研制信息
归口单位: TC 47
相似标准/计划/法规
现行
GOST 24461-1980
Приборы полупроводниковые силовые. Методы измерений и испытаний
功率半导体器件 测试和测量方法
现行
BS IEC 62830-4-2019
Semiconductor devices. Semiconductor devices for energy harvesting and generation-Test and evaluation methods for flexible piezoelectric energy harvesting devices
半导体器件 用于能量收集和发电的半导体器件
2019-03-05
现行
IEC 62830-4-2019
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices
半导体器件.能量收集和产生用半导体器件.第4部分:柔性压电能量收集装置的试验和评估方法
2019-02-27
现行
BS IEC 62830-6-2019
Semiconductor devices. Semiconductor devices for energy harvesting and generation-Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices
半导体器件 用于能量收集和发电的半导体器件
2019-08-07
现行
BS IEC 62951-2-2019
Semiconductor devices. Flexible and stretchable semiconductor devices-Evaluation method for electron mobility, sub-threshold swing, and threshold voltage of flexible devices
半导体器件 柔性可伸缩半导体器件
2019-04-30
现行
BS IEC 62830-5-2021
Semiconductor devices. Semiconductor devices for energy harvesting and generation-Test method for measuring generated power from flexible thermoelectric devices
半导体器件 用于能量收集和发电的半导体器件
2021-02-03
现行
IEC 60747-14-10-2019
Semiconductor devices - Part 14-10: Semiconductor sensors - Performance evaluation methods for wearable glucose sensors
半导体器件.第14-10部分:半导体传感器.可穿戴葡萄糖传感器的性能评估方法
2019-11-13
现行
KS C IEC 60747-14-10
반도체소자 — 제14-10부: 반도체센서 — 부착 삽입형 혈당 센서의 성능 평가 방법
半导体器件.第14-10部分:半导体传感器.可穿戴葡萄糖传感器的性能评估方法
2022-11-22
现行
BS EN IEC 62969-4-2018
Semiconductor devices. Semiconductor interface for automotive vehicles-Evaluation method of data interface for automotive vehicle sensors
半导体器件 汽车用半导体接口
2018-08-30
现行
IEC 62951-2-2019
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Evaluation method for electron mobility, sub-threshold swing and threshold voltage of flexible devices
半导体器件.柔性和可伸展半导体器件.第2部分:柔性器件的电子迁移率、亚阈值摆幅和阈值电压的评估方法
2019-04-17
现行
IEC 62830-6-2019
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6: Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices
半导体器件.能量收集和产生用半导体器件.第6部分:垂直接触式摩擦电能收集器件的试验和评定方法
2019-07-25
现行
KS C IEC 62830-6
반도체소자 ─ 에너지 획득 및 발전용 반도체소자 — 제6부: 수직 접촉 모드 마찰전기 에너지 획득소자의 시험 및 평가 방법
半导体器件.能量收集和产生用半导体器件.第6部分:垂直接触模式摩擦电能收集器件的试验和评估方法
2022-11-22
现行
BS IEC 62830-8-2021
Semiconductor devices. Semiconductor devices for energy harvesting and generation-Test and evaluation methods of flexible and stretchable supercapacitors for use in low power electronics
半导体器件 用于能量收集和发电的半导体器件
2021-11-04
现行
IEC 62830-5-2021
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices
半导体器件.能量收集和产生用半导体器件.第5部分:测量柔性热电器件产生功率的试验方法
2021-01-21
现行
BS EN 62007-2-2009
Semiconductor optoelectronic devices for fibre optic system applications-Measuring methods
光纤系统用半导体光电器件
2009-10-31
现行
KS C IEC 60747-5-3
개별 반도체 소자 및 집적 회로— 제5-3부: 광전 소자 — 측정 방법
分立半导体器件和集成电路 - 第5-3部分:光电器件 - 测量方法
2020-12-24
现行
BS EN 62047-26-2016
Semiconductor devices. Micro-electromechanical devices-Description and measurement methods for micro trench and needle structures
半导体器件 微机电设备
2016-05-31
现行
GB/T 15651.3-2003
半导体分立器件和集成电路 第5-3部分:光电子器件 测试方法
Discrete semiconductor devices and integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods
2003-11-24
现行
IEC 62969-4-2018
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors
半导体器件.汽车用半导体接口.第4部分:汽车传感器数据接口的评定方法
2018-06-18
现行
JEDEC JESD51-1
INTEGRATED CIRCUIT THERMAL MEASUREMENT METHOD - ELECTRICAL TEST METHOD (SINGLE SEMICONDUCTOR DEVICE)
集成电路热测量方法电气试验方法(单半导体器件)
1995-12-01