首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 BS EN IEC 62969-4:2018
到馆提醒
收藏跟踪
购买正版
Semiconductor devices. Semiconductor interface for automotive vehicles-Evaluation method of data interface for automotive vehicle sensors 半导体器件 汽车用半导体接口
发布日期: 2018-08-30
BS EN IEC 62969-4:2018规定了汽车发动机直接故障注入试验的方法 半导体传感器接口,可用于支持 车辆通信接口。交叉引用:IEC 60050-442IEC 60050-161IEC 60050-722购买时可用的所有现行修订版均包含在本文件的购买中。
BS EN IEC 62969-4:2018 specifies a method of directly fault injection test for automotive semiconductor sensor interface that can be used to support the conformance assurance in the vehicle communications interface.Cross References:IEC 60050-442IEC 60050-161IEC 60050-722All current amendments available at time of purchase are included with the purchase of this document.
分类信息
发布单位或类别: 英国-英国标准学会
关联关系
研制信息
相似标准/计划/法规
现行
BS EN IEC 62969-1-2018
Semiconductor devices. Semiconductor interface for automotive vehicles-General requirements of power interface for automotive vehicle sensors
半导体器件 汽车用半导体接口
2018-02-22
现行
IEC 62969-1-2017
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
半导体器件汽车半导体接口第1部分:汽车传感器电源接口的一般要求
2017-12-13
现行
IEC 62969-4-2018
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors
半导体器件.汽车用半导体接口.第4部分:汽车传感器数据接口的评定方法
2018-06-18
现行
BS EN IEC 62969-3-2018
Semiconductor devices. Semiconductor interface for automotive vehicles-Shock driven piezoelectric energy harvesting for automotive vehicle sensors
半导体器件 汽车用半导体接口
2018-06-28
现行
IEC 62969-3-2018
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
半导体器件汽车半导体接口第3部分:汽车传感器的冲击驱动压电能量收集
2018-05-07
现行
BS EN IEC 62969-2-2018
Semiconductor devices. Semiconductor interface for automotive vehicles-Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
半导体器件 汽车用半导体接口
2018-05-02
现行
IEC 62969-2-2018
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
半导体器件汽车半导体接口第2部分:汽车传感器共振无线电力传输效率评估方法
2018-03-08
现行
DIN EN IEC 62969-4
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors (IEC 62969-4:2018); German version EN IEC 62969-4:2018
半导体器件.汽车用半导体接口.第4部分:汽车传感器数据接口的评估方法(IEC 62969-4-2018);德国版本EN IEC 62969-4:2018
2019-03-01
现行
DIN EN IEC 62969-1
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors (IEC 62969-1:2017); German version EN IEC 62969-1:2018
半导体器件.汽车用半导体接口.第1部分:汽车传感器电源接口的一般要求(IEC 62969-1-2017);德国版本EN IEC 62969-1:2018
2018-08-01
现行
IEC TR 63357-2022
Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles
半导体器件.汽车故障试验方法的标准化路线图
2022-10-11
现行
BS EN 62779-2-2016
Semiconductor devices. Semiconductor interface for human body communication-Characterization of interfacing performances
半导体器件 用于人体通讯的半导体接口
2016-06-30
现行
DIN EN IEC 62969-3
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors (IEC 62969-3:2018); German version EN IEC 62969-3:2018
半导体器件.汽车用半导体接口.第3部分:汽车传感器的冲击驱动压电能量收集(IEC 62969-3-2018);德国版本EN IEC 62969-3:2018
2018-12-01
现行
BS IEC 62779-4-2020
Semiconductor devices. Semiconductor interface for human body communication-Capsule endoscope
半导体器件 用于人体通讯的半导体接口
2020-07-17
现行
BS EN 62779-1-2016
Semiconductor devices. Semiconductor interface for human body communication-General requirements
半导体器件 用于人体通讯的半导体接口
2016-06-30
现行
IEC 62779-2-2016
Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
半导体器件 - 用于人体通信的半导体接口 - 第2部分:接口性能的表征
2016-02-18
现行
DIN EN IEC 62969-2
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors (IEC 62969-2:2018); German version EN IEC 62969-2:2018
半导体器件.汽车用半导体接口.第2部分:汽车传感器用谐振无线功率传输的效率评估方法(IEC 62969-2-2018);德国版本EN IEC 62969-2:2018
2018-09-01
现行
IEC 62779-1-2016
Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
半导体器件 - 人体通信半导体界面 - 第1部分:一般要求
2016-02-18
现行
IEC 62779-4-2020
Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
半导体器件.人体通信用半导体接口.第4部分:胶囊内窥镜
2020-02-07
现行
BS EN 62779-3-2016
Semiconductor devices. Semiconductor interface for human body communication-Functional type and its operational conditions
半导体器件 用于人体通讯的半导体接口
2016-06-30
现行
IEC 62779-3-2016
Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
半导体器件人体通信用半导体接口第3部分:功能类型及其操作条件
2016-04-26