挠性印制电路用聚酯薄膜覆铜板
Copper-clad polyester film laminates for flexible printed circuits

2017-12-29

挠性印制电路用聚酰亚胺薄膜覆铜板
Copper-clad polyimide film laminates for flexible printed circuits

2017-12-29

Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)
挠性印制线路板用覆铜层压板（聚酯膜、聚酰亚胺膜）

1995-01-01

Пленка полиэфирная фольгированная для гибких печатных плат. Технические условия
用于柔性印刷板的覆箔聚酯薄膜 规格

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
印刷电路的基材 第2部分:规范 规格8:柔性覆铜聚酯（PETP）薄膜

1996-07-24

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
印刷电路的基材 第2部分:规范 规格8:柔性覆铜聚酯（PETP）薄膜

1996-10-23

Specifications-Specification for flexible copper-clad polyester (PETP) film
规格 挠性覆铜聚酯（PETP）薄膜规范

1995-02-01

挠性印制电路用涂胶聚酯薄膜
Adhesive coated polyester film for flexible printed circuits

2017-12-29

印制电路用挠性覆铜箔材料试验方法
Test methods for copper-clad material for flexible printed circuits

2017-07-31

Base material for printed circuits. Specifications-Flexible copper-clad polyimide film, general purpose grade
印刷电路的基材 规格 通用级挠性覆铜聚酰亚胺薄膜

1990-02-28

Материал электроизоляционный фольгированный нормированной горючести для печатных плат на основе нетканой (тканой) стеклоткани, пропитанной эпоксидным связующим. Технические условия
用于印刷板的额定可燃性的柔性箔包覆电绝缘材料的覆盖聚酯膜 规格

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
印刷电路的基材 第2部分:规范 规范15:规定易燃性的挠性覆铜聚酰亚胺薄膜

1996-07-24

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
印刷电路的基材 第2部分:规范 规范15:规定易燃性的挠性覆铜聚酰亚胺薄膜

1996-10-14

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范13:通用级挠性覆铜聚酰亚胺薄膜

1996-07-24

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范13:通用级挠性覆铜聚酰亚胺薄膜

1996-10-16

Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards)-Adhesive coated flexible polyester film
互连结构材料 包覆和未包覆的非增强基材分规范集（适用于柔性印制板） 涂有粘合剂的柔性聚酯薄膜 涂胶柔性聚酯薄膜

1999-06-15

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
印制板和其他互连结构用材料.第3-3部分:包覆和非包覆（柔性印制板用）无增强基材的分规范集.涂粘合剂的柔性聚酯薄膜

1999-02-10

Materials for printed boards and other interconnecting structures -- Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film.
印制板和其他互连结构用材料第3-3部分:覆层和非覆层（用于柔性印制板）非增强基材分规范集涂有粘合剂的柔性聚酯薄膜

2000-12-04

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards); adhesive coated flexible polyester film (IEC 61249-3-3:1999); German version EN 61249-3-3:1999
印制板和其他互连结构用材料.第3-3部分:覆层和非覆层（用于柔性印制板）无增强基材分规范集；涂有粘合剂的柔性聚酯薄膜（IEC 61249-3-3-1999）；德文版EN 61249-3-3:1999

1999-11-01