现行

GB/T 13555-2017

挠性印制电路用聚酰亚胺薄膜覆铜板
Copper-clad polyimide film laminates for flexible printed circuits

2017-12-29

现行

BS EN 60249-2-13-1994

Base material for printed circuits. Specifications-Flexible copper-clad polyimide film, general purpose grade
印刷电路的基材 规格 通用级挠性覆铜聚酰亚胺薄膜

1990-02-28

现行

JIS C 6472-1995

Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)
挠性印制线路板用覆铜层压板（聚酯膜、聚酰亚胺膜）

1995-01-01

现行

GB/T 13556-2017

挠性印制电路用聚酯薄膜覆铜板
Copper-clad polyester film laminates for flexible printed circuits

2017-12-29

现行

BS EN 60249-2-15-1994

Specifications-Flexible copper-clad polyimide film, of defined flammability
规格 规定可燃性的挠性覆铜聚酰亚胺薄膜

1991-06-28

现行

GB/T 14709-2017

挠性印制电路用涂胶聚酰亚胺薄膜
Adhesive coated polyimide film for flexible printed circuits

2017-12-29

现行

UNE-EN 60249-2-15-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
印刷电路的基材 第2部分:规范 规范15:规定易燃性的挠性覆铜聚酰亚胺薄膜

1996-07-24

现行

UNE-EN 60249-2-15/A1-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
印刷电路的基材 第2部分:规范 规范15:规定易燃性的挠性覆铜聚酰亚胺薄膜

1996-10-14

现行

GOST 26246.12-1989

Пленка полиимидная фольгированная общего назначения для гибких печатных плат. Технические условия
用于柔性印刷板的通用聚酰亚胺箔包覆膜 规格

现行

GOST 26246.13-1989

Пленка полиимидная фольгированная нормированной горючести для гибких печатных плат. Технические условия
用于柔性印刷板的额定可燃性的聚酰亚胺箔包覆膜 规格

现行

UNE-EN 60249-2-13-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范13:通用级挠性覆铜聚酰亚胺薄膜

1996-07-24

现行

UNE-EN 60249-2-13/A1-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范13:通用级挠性覆铜聚酰亚胺薄膜

1996-10-16

现行

GB/T 13557-2017

印制电路用挠性覆铜箔材料试验方法
Test methods for copper-clad material for flexible printed circuits

2017-07-31

现行

UNE-EN 60249-2-8-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
印刷电路的基材 第2部分:规范 规格8:柔性覆铜聚酯（PETP）薄膜

1996-07-24

现行

UNE-EN 60249-2-8/A1-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
印刷电路的基材 第2部分:规范 规格8:柔性覆铜聚酯（PETP）薄膜

1996-10-23

现行

JIS C 6490-1998

Base materials for printed circuits -- Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的聚酰亚胺玻璃纤维织物覆铜层压板（垂直燃烧试验）

1998-01-01

现行

JIS C 6493-1999

Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
印制电路用基材多层印制板制造用规定可燃性的薄型聚酰亚胺编织玻璃纤维覆铜层压板

1999-01-01

现行

IEC 61249-3-4-1999

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
印制板和其他互连结构用材料.第3-4部分:包层和非包层（用于柔性印制板）无增强基材的分规范集.涂有粘合剂的柔性聚酰亚胺薄膜

1999-02-10

现行

UNE-EN 61249-3-4-2000

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-4: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). ADHESIVE COATED FLEXIBLE POLYIMIDE FILM
印制板和其他互连结构用材料 第3-4部分:覆层和非覆层（用于柔性印制板）无加强基材分规范集 胶粘剂涂覆柔性聚酰亚胺薄膜

2000-11-17

现行

UNE-EN 60249-2-17-1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARD.
印刷电路的基材 第2部分:规范 规范Nº17:多层印制板制造用规定可燃性的薄聚酰亚胺编织玻璃纤维覆铜层压板

1997-08-11