现行

SJ/T 2709-2016

印制板组装件温度测试方法
Methods of measurement for temperature of printed board assemblies

2016-10-22

现行

BS EN 61189-11-2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Measurement of melting temperature or melting temperature ranges of solder alloys
电气材料、印制板和其他互连结构和组件的试验方法

2013-07-31

现行

IEC 61189-11-2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
电气材料 印刷电路板和其他互连结构和组件的测试方法 - 第11部分:焊接温度或熔融温度范围的测量

2013-05-07

现行

BS EN 61189-5-1-2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Guidance for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法

2016-10-31

现行

BS IEC 61189-5-3-2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用焊膏

2015-01-31

现行

BS IEC 61189-5-2-2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用助焊剂

2015-01-31

现行

BS EN 61189-5-2-2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Soldering flux for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用助焊剂

2015-04-30

现行

BS EN 61189-5-3-2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Soldering paste for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用焊膏

2015-04-30

现行

BS EN 61191-6-2010

Printed board assemblies-Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
印制板组件

2010-05-31

现行

IPC 9708

Test Methods for Characterization of Printed Board Assembly Pad Cratering
印制板组件焊盘凹坑特性的试验方法

2010-12-01

现行

IEC 61189-5-1-2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
电气材料 印刷电路板和其他互连结构和组件的测试方法 - 第5-1部分:材料和组件的一般测试方法 - 印刷电路板组件的指导

2016-07-05

现行

BS EN 61189-3-2008

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Test methods for interconnection structures (printed boards)
电气材料、印制板和其他互连结构和组件的试验方法

2008-03-31

现行

BS EN 61189-5-2006

Test methods for electrical materials, interconnection structures and assemblies-Test methods for printed board assemblies
电气材料、互连结构和组件的试验方法

2009-02-28

现行

IEC 61189-5-3-2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
电气材料 印刷电路板和其他互连结构和组件的测试方法 - 第5-3部分:材料和组件的一般测试方法 - 印刷电路板组件的焊膏

2015-01-08

现行

IEC 61189-5-2-2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
电气材料 印刷电路板和其他互连结构和组件的测试方法第5-2部分:材料和组件的通用测试方法 - 印刷电路板组件的焊剂焊剂

2015-01-08

现行

KS C IEC 61189-5-2

전기재료, 인쇄기판 및 다른 상호접속용 구조 및 조립품에 대한 시험방법 — 제5-2부: 재료 및 조립에 대한 일반 시험방법 — 인쇄기판 조립을 위한 땜질 플럭스
电气材料、印制板和其他互连结构和组件的试验方法.第5-2部分:材料和组件的一般试验方法.印制板组件用助焊剂

2023-06-30

现行

KS C IEC 61189-5-3

전기재료, 인쇄기판 및 다른 상호접속용 구조 및 조립품에 대한 시험방법 — 제5-3부: 재료 및 조립에 대한 일반 시험방법 — 인쇄기판 조립을 위한 솔더 페이스트
电气材料、印制板和其他互连结构和组件的试验方法.第5-3部分:材料和组件的一般试验方法.印制板组件用焊膏

2023-06-30

现行

IEC 61191-6-2010

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
印刷板组件 - 第6部分:Bga和Lga焊接接头空隙评估标准及测量方法

2010-01-14

现行

GB/T 19247.6-2024

印制板组装 第6部分:球栅阵列（BGA）和盘栅阵列（LGA）焊点空洞的评估要求及测试方法
Printed board assemblies—Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

2024-03-15

现行

SJ 20137-1992

印制板组装件抗振动冲击技术要求和测试方法
Technical specification, vibration and shock test methods for printed board assembly

1992-11-19