本标准建立了测试适用于军事和航空航天电子系统的半导体器件的统一方法和程序。本标准各部分中的方法和程序包括基本的环境、物理和电气试验，以确定对军事和空间行动周围自然因素和条件的有害影响的耐受性。在本标准中，术语“设备”包括晶体管、二极管、电压调节器、整流器、隧道二极管和其他相关部件。本标准仅适用于半导体器件。本多部分试验方法标准各部分中所述的试验方法和程序用于以下目的: a、 规定实验室可获得的适当条件，使试验结果相当于现场现有的实际使用条件，并获得试验结果的再现性。本标准所述的测试方法不应被解释为任何一个地理位置实际运行的准确和决定性代表，因为已知在特定位置运行的唯一真实测试是该点的实际运行测试。b、 在一系列标准中，描述目前出现在各种联合服务半导体器件规范中的所有具有类似特征的试验方法，以便这些试验方法保持一致，从而保护设备，包括:- 时间和测试设施。为了实现这一目标，有必要使每种通用测试方法适用于广泛的设备。c、 本标准所述的半导体器件环境、物理和电气试验的试验方法，在适用时，也应适用于批准的军用表格标准、规范表或图纸中未涵盖的零件。

This standard establishes uniform methods and procedures for testing semiconductor devices suitable for use within Military and Aerospace electronic systems. The methods and procedures in the various parts of this standard cover basic environmental, physical, and electrical tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations. For the purpose of this standard, the term "devices" includes such items as transistors, diodes, voltage regulators, rectifiers, tunnel diodes, and other related parts. This standard is intended to apply only to semiconductor devices. The test methods and procedures described in the various parts of this multipart test method standard have been prepared to serve several purposes: a. To specify suitable conditions obtainable in the laboratory that give test results equivalent to the actual service conditions existing in the field and to obtain reproducibility of the results of tests. The test methods described by this standard are not to be interpreted as an exact and conclusive representation of actual service operation in any one geographic location since it is known that the only true test for operation in a specific location is an actual service test at that point. b. To describe, in a series of standards, all of the test methods of a similar character which now appear in the various joint-services semiconductor device specifications so that these test methods may be kept uniform and thus result in conservation of equipment, man-hours, and testing facilities. In achieving this objective, it is necessary to make each of the general test methods adaptable to a broad range of devices. c. The test methods described by this standard for environmental, physical, and electrical testing of semiconductor devices shall also apply, when applicable, to parts not covered by an approved military sheet-form standard, specification sheet, or drawing.