现行

SJ 21333-2018

陶瓷外壳及金属外壳钎焊工艺技术要求
Ceramic package and metal package Technical requirements for braze process

2018-01-18

现行

SJ 21328-2018

金属外壳 熔封工艺技术要求
Metal packages Technical requirements for Glass-to-Metal sealing process

2018-01-18

现行

SJ 21334-2018

陶瓷外壳及金属外壳电镀镍工艺技术要求
Ceramic packages and metal packages Technical requirements for nickel electroplating process

2018-01-18

现行

SJ 21331-2018

陶瓷外壳及金属外壳金属零件热处理工艺技术要求
Ceramic packages and metal packages Technical requirements for the heat treatment of the metal parts process

2018-01-18

现行

SJ 21407-2018

微电子封装陶瓷及金属外壳零件清洗工艺技术要求
Ceramic and metal packages for microelectronic packaging-Technical requirements for parts cleaning process

2018-01-18

现行

SJ 21403-2018

微电子封装金属外壳玻璃绝缘子工艺技术要求
Metal packages for microelectronic packaging-Technical requirements for the manufacturing process of glass insulator

2018-01-18

现行

SJ 21332-2018

陶瓷外壳及金属外壳化学镀镍工艺技术要求
Ceramic packages and metal packages Technical requirements for electroless nickel plating process

2018-01-18

现行

SJ 21402-2018

微电子封装陶瓷及金属外壳纤焊后处理工艺技术要求
Ceramic and metal packages for microelectronics packaging-Technical requirements for processing after brazing

2018-01-18

现行

SJ 21405-2018

微电子封装金属外壳铝硅外壳镀覆工艺技术要求
Metal packages for microelectronic packaging-Technical requirements for the plating process of aluminium-silicon alloy packages

2018-01-18

现行

SJ 21327-2018

陶瓷外壳贴装类装架工艺技术要求
Ceramic packages Technical requirements for assembling process of surface-mounted type

2018-01-18

现行

SJ 21326-2018

陶瓷外壳 插装类装架工艺技术要求
Ceramic packages Technical requirements for assembling process of through-hole type

2018-01-18

现行

SJ 21404-2018

微电子封装金属外壳可伐零件预氧化工艺技术要求
Metal packages for microelectronic packaging-Technical requirements for the pre-oxidation process of Kovar piece-parts

2018-01-18

现行

SJ 21399-2018

微电子封装陶瓷及金属外壳组装件检验要求
Ceramic and metal packages for microelectronic packaging-Inspection requirements for assembly parts

2018-01-18

现行

SJ 21401-2018

微电子封装陶瓷外壳磨边及裂片工艺技术要求
Ceramic packages for microelectronics packaging-Technical requirements for edge-grinding and splitting process

2018-01-18

现行

SJ 21408-2018

微电子封装陶瓷外壳 激光切割及打标工艺技术要求
Ceramic packages for microelectronic packaging-Technical requirements for laser cutting and laser marking process

2018-01-18

现行

SJ 21276-2018

微波组件键合工艺技术要求
Process technical requirements for wire bonding of microwave assembly

2018-01-18

现行

SJ 21074-2016

微波组件返修工艺技术要求
Technical requirements for reworking and repairing process of microwave assembly

2016-01-19

现行

GB/T 43538-2023

集成电路金属封装外壳质量技术要求
Quality and technical requirements for metal packages used for integrated circuits

2023-12-28

现行

SJ 21451-2018

集成电路陶瓷封装圆片划片工艺技术要求
Integrated circuit ceramic package-Technical requirement for wafer-sawing process

2018-01-18

现行

SJ 21450-2018

集成电路陶瓷封装圆片减薄工艺技术要求
Integrated circuit ceramic package-Technical requirement for wafer-thinning process

2018-01-18