现行

UL Subject 94

Standard for Tests for Flammability of Plastic Materials for Parts in Devices and Appliances (CSDS Proposal, 12/4/2015)
装置和器具零件用塑料材料易燃性试验标准（CSDS提案 12/4/2015）

2015-12-04

现行

UNE-EN 60749-32-2004

Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
半导体器件机械和气候试验方法第32部分:塑料封装器件的可燃性（外部诱导）

2004-03-18

现行

IEC 60749-32-2002+AMD1-2010 CSV

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
半导体器件.机械和气候试验方法.第32部分:塑料封装器件的可燃性（外部诱导）

2010-11-29

现行

IEC 60749-31-2002

Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
半导体器件 - 机械和气候测试方法 - 第31部分:塑料封装器件的易燃性（内部诱导）

2002-08-30

现行

IEC 60749-32-2002

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
半导体器件 - 机械和气候测试方法 - 第32部分:塑料封装器件的易燃性（外部诱导）

2002-08-30

现行

KS C IEC 60749-31(2016 Confirm)

반도체 소자－기계 및 기후적 환경 시험 방법－제31부：플라스틱 캡슐 봉합 소자의 가연성(내부적 요인)
半导体器件机械和气候试验方法第31部分:塑料封装器件的可燃性（内感应）

2006-11-30

现行

KS C IEC 60749-32(2016 Confirm)

반도체 소자－기계 및 기후적 환경 시험 방법－제32부：플라스틱 캡슐 봉합 소자의 가연성(외부적 요인)
半导体器件机械和气候试验方法第32部分:塑料封装器件的可燃性（外部感应）

2006-11-30

现行

KS C IEC 60749-31(2021 Confirm)

반도체 소자－기계 및 기후적 환경 시험 방법－제31부：플라스틱 캡슐 봉합 소자의 가연성(내부적 요인)
半导体器件机械和气候试验方法第31部分:塑料封装器件的可燃性（内部感应）

2006-11-30

现行

KS C IEC 60749-32

반도체 소자 — 기계 및 기후 시험방법 — 제32부: 플라스틱 캡슐봉합 소자의 가연성(외부적 요인)
半导体器件.机械和气候试验方法.第32部分:塑料封装器件的可燃性（外部诱导）

2021-12-29

现行

UNE-EN 60749-31-2004

Semiconductor devices - Mechanical and climatic test methods -- Part 31: Flammability of plastic-encapsulated devices (internally induced)
半导体器件机械和气候试验方法第31部分:塑料封装器件的可燃性（内部感应）

2004-03-18

现行

BS EN 60749-31-2003

Semiconductor devices. Mechanical and climatic test methods-Flammability of plastic-encapsulated devices (internally induced)
半导体器件 机械和气候试验方法

2003-07-04

现行

BS EN 60749-32-2003+A1-2010

Semiconductor devices. Mechanical and climatic test methods-Flammability of plastic-encapsulated devices (externally induced)
半导体器件 机械和气候试验方法

2011-03-31

现行

IEC 60749-32-2002/AMD1-2010

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
修改件1.半导体器件.机械和气候试验方法.第32部分:塑料封装器件的可燃性（外部诱导）

2010-07-28

现行

AS 1530.2-1993

Methods for fire tests on building materials, components and structures, Part 2: Test for flammability of materials
建筑材料、构件和结构防火试验方法第2部分:材料可燃性试验

1993-04-13

现行

GB/T 28876.2-2014

空间实验设备使用材料的可燃性 第2部分：测试方法
Flammability of materials in space experimental facilities―Part 2: Test methods

2014-12-05

现行

ASTM D7309-21b

Standard Test Method for Determining Flammability Characteristics of Plastics and Other Solid Materials Using Microscale Combustion Calorimetry
用微尺度燃烧量热法测定塑料和其他固体材料易燃特性的标准试验方法

2021-10-01

现行

GB/T 4937.31-2023

半导体器件 机械和气候试验方法 第31部分：塑封器件的易燃性（内部引起的）
Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices（internally induced）

2023-05-23

现行

GB/T 4937.32-2023

半导体器件 机械和气候试验方法 第32部分：塑封器件的易燃性（外部引起的）
Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices（externally induced）

2023-05-23

现行

SAE J576_201708

Plastic Material or Materials for Use in Optical Parts Such as Lenses and Reflex Reflectors of Motor Vehicle Lighting Devices
塑料材料或用于光学部件的材料 如汽车照明设备的透镜和回复反射器

2017-08-07

现行

TB/T 3079.3-2005

装载加固材料和装置 第3部分：铁泥塑料挡
Material and Device for Loading and Securing Freight-Part 3:Block of Synthetics of Iron and Plastic

2005-08-19