现行

SJ/T 10147-1991

集成电路防静电包装管
Package tubes against static for integrated circuits

1991-04-02

现行

GB/T 8976-1996

膜集成电路和混合膜集成电路总规范
Generic specification for film integrated circuits and hybrid film integrated circuits

1996-07-09

现行

QJ 1995A-1998

集成电路验收规范

1998-08-05

现行

KS C IEC 60748-20

반도체 소자 — 집적회로 — 제20부: 필름 집적회로 및 하이브리드 필름 집적회로의 일반 규격서
半导体器件集成电路第20部分:薄膜集成电路和混合薄膜集成电路总规范

2021-12-29

现行

EIA JEP130

Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing
单元容器包装中集成电路的包装和标签指南

1997-08-01

现行

IEC 60748-20-1988

Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
半导体器件 集成电路 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范

1988-06-30

现行

KS C IEC 60748-20

반도체 소자 — 집적회로 — 제20부: 필름 집적회로 및 하이브리드 필름 집적회로의 일반 규격서
半导体器件 - 集成电路 - 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范

2019-12-31

现行

KS C IEC 60748-2-20

반도체 소자 — 집적회로 — 제20부: 필름 집적회로 및 하이브리드 필름 집적회로의 하이브리드 필름 집적회로의 일반 규격서
半导体器件 - 集成电路 - 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范

2019-12-31

现行

BS IEC 63011-3-2018

Integrated circuits. Three dimensional integrated circuits-Model and measurement conditions of through-silicon via
集成电路 三维集成电路

2019-01-24

现行

BS IEC 63011-2-2018

Integrated circuits. Three dimensional integrated circuits-Alignment of stacked dies having fine pitch interconnect
集成电路 三维集成电路

2019-01-24

现行

BS IEC 63011-1-2018

Integrated circuits. Three dimensional integrated circuits-Terminology
集成电路 三维集成电路

2019-01-24

现行

GOST 29109-1991

Приборы полупроводниковые. Микросхемы интегральные. Часть 4. Интерфейсные интегральные схемы
半导体器件 集成电路 接口集成电路

现行

MIL MIL-PRF-38535L

Integrated Circuits (Microcircuits) Manufacturing, General Specification for
集成电路（微电路）制造通用规范

2018-12-06

现行

MIL MIL-PRF-38535J Amendment 1(amendment incorporated)

Integrated Circuits (Microcircuits) Manufacturing, General Specification for
集成电路（微电路）制造通用规范

2012-05-14

现行

BS IEC 60748-11-2000

Semiconductor devices. Integrated circuits-Sectional specification for semiconductor integrated circuits excluding hybrid circuits
半导体器件 集成电路 不包括混合电路的半导体集成电路分规范

2011-07-31

现行

KS C IEC 60748-2-20

반도체 소자 — 집적 회로 — 제2-20부: 디지털 집적 회로 — 저전압 집적 회로 계열의 기준
半导体器件集成电路第2-20部分:数字集成电路系列规范低压集成电路

2021-12-29

现行

IEC 60748-2-20-2008

Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
半导体器件 - 集成电路 - 第2-20部分:数字集成电路 - 系列规范 - 低压集成电路

2008-02-27

现行

GB/T 17574.20-2006

半导体器件 集成电路 第2-20部分：数字集成电路 低压集成电路族规范
Semiconductor devices - Integrated circuits - Part 2-20：Digital integrated circuits - Family specification - Low voltage integrated circuits

2006-12-05

现行

GB/T 16465-1996

膜集成电路和混合膜集成电路分规范（采用能力批准程序）
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

1996-07-09

现行

GOST 29108-1991

Приборы полупроводниковые. Микросхемы интегральные. Часть 3. Аналоговые интегральные схемы
半导体器件 集成电路 模拟集成电路