现行

GB/T 12842-1991

膜集成电路和混合膜集成电路术语
Terminology for film integrated circuits and hybrid film integrated circuits

1991-04-28

现行

GB/T 8976-1996

膜集成电路和混合膜集成电路总规范
Generic specification for film integrated circuits and hybrid film integrated circuits

1996-07-09

现行

BS EN 165000-3-1996

Film and hybrid integrated circuits-Self-audit checklist and report for film and hybrid integrated circuit manufacturers
薄膜和混合集成电路 薄膜和混合集成电路制造商的自我审计检查表和报告

1996-10-15

现行

GB/T 15138-1994

膜集成电路和混合集成电路外形尺寸
Case outlines for film integrated circuits and hybrid integrated circuits

1994-06-25

现行

IEC 60748-21-1-1997

Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
半导体器件集成电路第21-1部分:坯料 薄膜集成电路和混合薄膜详细规范 基于资格认证的集成电路 程序

1997-04-10

现行

IEC 60748-22-1-1997

Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
半导体器件 - 集成电路 - 第22-1部分:基于能力审批程序的薄膜集成电路和混合薄膜集成电路的空白详细规范

1997-04-10

现行

GB/T 13062-2018

半导体器件 集成电路 第21-1部分：膜集成电路和混合膜集成电路空白详细规范（采用鉴定批准程序）
Semiconductor devices—Integrated circuits—Part 21-1：Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures

2018-12-28

现行

IEC 60748-20-1988

Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
半导体器件 集成电路 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范

1988-06-30

现行

KS C IEC 60748-20

반도체 소자 — 집적회로 — 제20부: 필름 집적회로 및 하이브리드 필름 집적회로의 일반 규격서
半导体器件 - 集成电路 - 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范

2019-12-31

现行

KS C IEC 60748-2-20

반도체 소자 — 집적회로 — 제20부: 필름 집적회로 및 하이브리드 필름 집적회로의 하이브리드 필름 집적회로의 일반 규격서
半导体器件 - 集成电路 - 第20部分:薄膜集成电路和混合薄膜集成电路的通用规范

2019-12-31

现行

KS C IEC 60748-20

반도체 소자 — 집적회로 — 제20부: 필름 집적회로 및 하이브리드 필름 집적회로의 일반 규격서
半导体器件集成电路第20部分:薄膜集成电路和混合薄膜集成电路总规范

2021-12-29

现行

GB/T 16465-1996

膜集成电路和混合膜集成电路分规范（采用能力批准程序）
Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

1996-07-09

现行

BS IEC 60748-23-4-2002

Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification-Blank detail specification
半导体器件 集成电路 混合集成电路和薄膜结构 生产线认证

2002-06-18

现行

BS EN 165000-5-1998

Film and hybrid integrated circuits-Procedure for qualification approval
薄膜和混合集成电路 资格批准程序

1998-03-15

现行

BS QC 760101-1997

Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
电子元件质量评定协调体系 半导体器件 集成电路 基于资格认证程序的薄膜集成电路和混合薄膜集成电路空白详细规范

1997-08-15

现行

BS QC 760201-1997

Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
电子元件质量评定协调体系 半导体器件 集成电路 基于能力批准程序的薄膜集成电路和混合薄膜集成电路空白详细规范

1997-08-15

现行

IEC 60748-20-1988/AMD1-1995

Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
修改件1——半导体器件 集成电路 第20部分:薄膜集成电路和混合薄膜集成电路总规范

1995-09-22

现行

BS EN 165000-4-1996

Film and hybrid integrated circuits-Customer information, product assessment level schedules and blank detail specification
薄膜和混合集成电路 客户信息、产品评估级别计划和空白详细规范

1996-10-15

现行

IEC 60748-21-1997

Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
半导体器件集成电路第21部分:分规范 薄膜集成电路和混合薄膜规范 基于资格认证的集成电路 程序

1997-04-10

现行

IEC 60748-22-1997

Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
半导体器件 - 集成电路 - 第22部分:基于能力审批程序的薄膜集成电路和混合薄膜集成电路的分段规范

1997-04-10