现行

GB/T 30866-2014

碳化硅单晶片直径测试方法
Test method for measuring diameter of monocrystalline silicon carbide wafers

2014-07-24

现行

SJ/T 11487-2015

半绝缘半导体晶片电阻率的无接触测量方法
Non-contact measurement method for the resistivity of semi-insulating semiconductor wafer

2015-04-30

现行

GB/T 6616-2023

半导体晶片电阻率及半导体薄膜薄层电阻的测试 非接触涡流法
Test method for resistivity of semiconductor wafers and sheet resistance of semiconductor films—Noncontact eddy-current gauge

2023-08-06

现行

SCTE 31 2016

Test Method for Measuring Diameter Over Core
测量芯子直径的试验方法

现行

SJ 20636-1997

IC用大直径薄硅片的氧、碳含量微区试验方法
Test method for oxygen and carbon contents of large diameter thin silicon wafer in microzone for use in IC

1997-06-17

现行

SJ/T 11492-2015

光致发光法测定磷镓砷晶片的组分
Test methods for measurement of composition of gallium arsenide phosphide wafers by photoluminescence

2015-04-30

现行

GB/T 29505-2013

硅片平坦表面的表面粗糙度测量方法
Test method for measuring surface roughness on planar surfaces of silicon wafer

2013-05-09

现行

SJ/T 11503-2015

碳化硅单晶抛光片表面粗糙度的测试方法
Test methods for measuring surface roughness of polished monocrystalline silicon carbide wafers

2015-04-30

现行

GB/T 13387-2009

硅及其它电子材料晶片参考面长度测量方法
Test method for measuring flat length wafers of silicon and other electronic materials

2009-10-30

现行

GB/T 6617-2009

硅片电阻率测定 扩展电阻探针法
Test method for measuring resistivity of silicon wafer using spreading resistance probe

2009-10-30

现行

GB/T 19922-2005

硅片局部平整度非接触式标准测试方法
Standard test methods for measuring site flatness on silicon wafers by noncontact scanning

2005-09-19

现行

BS IEC 62047-34-2019

Semiconductor devices. Micro-electromechanical devices-Test methods for MEMS piezoresistive pressure-sensitive device on wafer
半导体器件 微机电设备

2019-04-16

现行

GOST 24461-1980

Приборы полупроводниковые силовые. Методы измерений и испытаний
功率半导体器件 测试和测量方法

现行

GB/T 30867-2014

碳化硅单晶片厚度和总厚度变化测试方法
Test method for measuring thickness and total thickness variation of monocrystalline silicon carbide wafers

2014-07-24

现行

GB/T 30868-2014

碳化硅单晶片微管密度的测定 化学腐蚀法
Test method for measuring micropipe density of monocrystalline silicon carbide wafers―Chemically etching

2014-07-24

现行

IEC 62047-34-2019

Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
半导体器件微机电器件第34部分:硅片上MEMS压阻压敏器件的试验方法

2019-04-05

现行

BS EN IEC 60793-1-45-2018

Optical fibres-Measurement methods and test procedures. Mode field diameter
光纤

2018-02-22

现行

DIN EN 62880-1-DRAFT

Draft Document - Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method (IEC 47/2191/CD:2014)
文件草稿.半导体器件.半导体器件的晶圆级可靠性.第1部分:铜应力迁移试验方法（IEC 47/2191/CD:2014）

2014-08-01

现行

BS EN 62047-16-2015

Semiconductor devices. Micro-electromechanical devices-Test methods for determining residual stresses of MEMS films. Wafer curvature and cantilever beam deflection methods
半导体器件 微机电设备

2015-07-31

现行

SJ/T 11490-2015

低位错密度砷化镓抛光片蚀坑密度的测量方法
Test method for measuring etch pit density (EPD) in low dislocation density gallium arsenide wafers

2015-04-30