首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 IEC 62047-36:2019
到馆阅读
收藏跟踪
购买正版
Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films 半导体器件微机电器件第36部分:MEMS压电薄膜的环境和介电耐受试验方法
发布日期: 2019-04-05
IEC 62047-36:2019(E)规定了在温度和湿度环境应力以及电应力下评估MEMS压电薄膜材料耐久性的试验方法,以及适当质量评估的试验条件。具体而言,本文件规定了在温度、湿度条件和外加电压下测量DUT耐久性的试验方法和试验条件。它还适用于评估主要在硅衬底上形成的压电薄膜(即用作致动器的压电薄膜)的逆压电性能。本文件不包括可靠性评估,例如基于威布尔分布预测压电薄膜寿命的方法。
IEC 62047-36:2019 (E) specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under electrical stress, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of converse piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e., piezoelectric thin films used as actuators. This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.
分类信息
关联关系
研制信息
归口单位: TC 47/SC 47F
相似标准/计划/法规
现行
IEC 62047-20-2014
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
半导体器件微机电器件第20部分:陀螺仪
2014-06-26
现行
IEC 62047-1-2016
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
半导体器件 - 微机电器件 - 第1部分:术语和定义
2016-01-06
现行
IEC 62047-19-2013
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
半导体器件 - 微机电器件 - 第19部分:电子罗盘
2013-07-17
现行
GB/T 42709.19-2023
半导体器件 微电子机械器件 第19部分:电子罗盘
Semiconductor devices—Micro-electromechanical devices—Part 19: Electronic compasses
2023-08-06
现行
IEC 62047-40-2021
Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
半导体器件.微机电器件.第40部分:微机电惯性冲击开关阈值的试验方法
2021-09-03
现行
IEC 62047-4-2008
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
半导体器件 - 微机电器件第4部分:Mems的通用规范
2008-08-21
现行
IEC 62047-5-2011
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
半导体器件 - 微机电器件 - 第5部分:RF MEMS开关
2011-07-13
现行
GB/T 42709.5-2023
半导体器件 微电子机械器件 第5部分:射频MEMS开关
Semiconductor devices—Micro-electromechanical devices—Part 5: RF MEMS switches
2023-05-23
现行
IEC 62047-10-2011
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
半导体器件 - 微机电器件 - 第10部分:MEMS材料的微柱压缩测试
2011-07-26
现行
IEC 62047-33-2019
Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
半导体器件微机电器件第33部分:MEMS压阻压敏器件
2019-04-05
现行
IEC 62047-43-2024
Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
半导体器件.微机电器件.第43部分:柔性微机电器件循环弯曲变形后电气特性的试验方法
2024-03-19
现行
IEC 62047-41-2021
Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
半导体器件.微机电器件.第41部分:RF MEMS环行器和隔离器
2021-06-15
现行
IEC 62047-26-2016
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
半导体器件 - 微机电器件 - 第26部分:微沟槽和针结构的描述和测量方法
2016-01-07
现行
IEC 62047-11-2013
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
半导体器件 - 微机电器件 - 第11部分:用于微机电系统的自由立体材料的线性热膨胀系数的测试方法
2013-07-17
现行
IEC 62047-22-2014
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
半导体器件微机电器件第22部分:柔性衬底上导电薄膜的机电拉伸试验方法
2014-06-19
现行
IEC 62435-7-2020
Electronic components - Long-term storage of electronic semiconductor devices - Part 7: Micro-electromechanical devices
电子元件.电子半导体器件的长期储存.第7部分:微机电装置
2020-12-04
现行
IEC 62047-18-2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
半导体器件 - 微机电器件 - 第18部分:薄膜材料的弯曲测试方法
2013-07-17
现行
IEC 62047-2-2006
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
半导体器件 - 微机电器件 - 第2部分:薄膜材料的拉伸测试方法
2006-08-15
现行
IEC 62047-32-2019
Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
半导体器件微机电器件第32部分:MEMS谐振器非线性振动的试验方法
2019-01-24
现行
IEC 62047-9-2011
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
半导体器件 - 微机电器件 - 第9部分:晶圆晶片接合强度测量
2011-07-13