Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
修改件6——半导体器件的机械标准化 第2部分:尺寸

2002-05-01

Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
修改件5——半导体器件的机械标准化 第2部分:尺寸

2002-02-12

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
半导体器件机械标准化 - 第6部分:表面贴装半导体器件封装外形图准备的一般规则

2009-11-26

BS EN 60191-6-5. Mechanical standardization of semiconductor devices. Part 6-5. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitch ball grid array (FBGA)
英国标准EN 60191-6-5 半导体器件的机械标准化 第6-5部分 表面安装半导体器件封装外形图绘制的一般规则 细间距球栅阵列（FBGA）设计指南

2009-10-26

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
半导体器件的机械标准化.第6-16部分:BGA、LGA、FBGA和FLGA用半导体测试和老化插座词汇表

2007-04-26

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
半导体器件的机械标准化 - 第6-5部分:表面贴装半导体器件封装外形图的一般规则 - 细间距球栅阵列设计指南（fbga）

2001-08-27

Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
半导体器件的机械标准化第6-5部分:表面安装半导体器件封装外形图绘制的一般规则细间距球栅阵列（FBGA）设计指南

2002-06-28

IEC 60191-6-16. Mechanical standardization of semiconductor devices. Part 6-16. Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA
IEC 60191-6-16 半导体器件的机械标准化 第6-16部分 BGA、LGA、FBGA和FLGA用半导体测试和老化插座词汇表

2005-04-27

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化.第6-10部分:表面安装半导体器件封装外形图制备的一般规则.P-VSON的尺寸

2003-11-19

Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化第6-10部分:表面安装半导体器件封装外形图绘制的一般规则P-VSON的尺寸

2004-05-28

BS EN 60191-6. Mechanical standardization of semiconductor devices. Part 6. General rules for the preparation of outline drawings of surface mounted semicondutor device packages
英国标准EN 60191-6 半导体器件的机械标准化 第六部分 表面安装半导体器件封装外形图绘制通则

2007-06-25

半导体器件的机械标准化 第5部分：用于集成电路载带自动焊（TAB）的推荐值
Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits

2018-09-17

Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
半导体器件的机械标准化第6-6部分:表面安装半导体器件封装外形图绘制的一般规则细间距栅极阵列（FLGA）设计指南

2002-03-21

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
半导体器件的机械标准化 - 第6-6部分:表面贴装半导体器件封装外形图准备的一般规则 - 精细间距土地网格阵列（flga）设计指南

2001-03-22

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
半导体器件的机械标准化 - 第6-19部分:高温下封装翘曲的测量方法和最大允许翘曲

2010-02-25

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
半导体器件的机械标准化 - 第6-18部分:表面安装半导体器件封装外形图的准备通则 - 球栅阵列（BGA）设计指南

2010-01-07

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
半导体器件的机械标准化 - 第6-1部分:表面贴装半导体器件封装外形图的一般规则 - 鸥翼引线端子设计指南

2001-10-30

Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals.
半导体器件的机械标准化第6-1部分:表面安装半导体器件封装外形图绘制的一般规则鸥翼引线端子的设计指南

2002-06-28

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
半导体器件的机械标准化 - 第5部分:使用磁带自动焊接（集成电路）应用于集成电路封装的建议

1997-04-23

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
半导体器件的机械标准化.第6-6部分:表面安装半导体器件封装外形图绘制的一般规则；细间距地栅阵列（FLGA）的设计指南（IEC 60191-6-6-2001）；德文版本EN 60191-6-6:2001

2002-02-01