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现行 IEC 62047-8:2011
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Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films 半导体器件 - 微机电器件 - 第8部分:用于薄膜拉伸性能测量的带钢弯曲试验方法
发布日期: 2011-03-14
IEC 62047-8:2011规定了带材弯曲试验方法,与传统拉伸试验相比,该方法测量薄膜的拉伸性能,具有高精度、可重复性、适度的对准和处理力度。该测试方法适用于厚度在50 nm和几mm之间、长宽比(长厚比)大于300的试样。在MEMS或微机械中,两个固定支架之间的吊带(或桥)被广泛采用。与传统拉伸试件相比,制造这些试件要容易得多。测试程序非常简单,易于自动化。该国际标准可用于MEMS生产的质量控制测试,因为与传统拉伸测试相比,其测试吞吐量非常高。
IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the conventional tensile test. This testing method is valid for test pieces with a thickness between 50 nm and several mum, and with an aspect ratio (ratio of length to thickness) of more than 300. The hanging strip (or bridge) between two fixed supports are widely adopted in MEMS or micro-machines. It is much easier to fabricate these strips than the conventional tensile test pieces. The test procedures are so simple to be readily automated. This international standard can be utilized as a quality control test for MEMS production since its testing throughput is very high compared to the conventional tensile test.
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归口单位: TC 47/SC 47F
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