现行

MIL MIL-STD-750-1A Change 2

Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999
半导体器件环境试验方法第1部分:试验方法1000～1999

2016-08-12

现行

MIL MIL-STD-750-1A Change 1

Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999
半导体器件环境试验方法第1部分:试验方法1000～1999

2016-05-13

现行

MIL MIL-STD-750-1 Change 3(all previous changes incorporated)

Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999
半导体器件环境试验方法第1部分:试验方法1000～1999

2013-10-01

现行

MIL MIL-STD-750-1 Change 2(all previous changes incorporated)

Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999
半导体器件环境试验方法第1部分:试验方法1000～1999

2013-07-01

现行

MIL MIL-STD-750-1 Change 1(change incorporated)

Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999
半导体器件环境试验方法第1部分:试验方法1000～1999

2013-03-11

现行

MIL MIL-STD-750-1 Change 5(all previous changes incorporated)

Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999
半导体器件环境试验方法第1部分:试验方法1000～1999

2015-04-24

现行

MIL MIL-STD-750-1 Change 4(all previous changes incorporated)

Environmental Test Methods for Semiconductor Devices Part 1: Test Methods 1000 Through 1999
半导体器件环境试验方法第1部分:试验方法1000～1999

2014-08-22

现行

IEC 63364-1-2022

Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection
半导体器件物联网系统用半导体器件第1部分:声音变化检测的试验方法

2022-12-14

现行

IEC 60749-1-2002

Semiconductor devices - Mechanical and climatic test methods - Part 1: General
半导体器件 - 机械和气候测试方法 - 第1部分:总则

2002-08-30

现行

KS C IEC 60749-1(2016 Confirm)

반도체 소자－기계 및 기후적 환경 시험 방법－제1부：일반 사항
半导体器件机械和气候试验方法第1部分:总则

2006-11-30

现行

KS C IEC 60749-1(2021 Confirm)

반도체 소자－기계 및 기후적 환경 시험 방법－제1부：일반 사항
半导体器件机械和气候试验方法第1部分:总则

2006-11-30

现行

UNE-EN 60749-1-2004

Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
半导体器件机械和气候试验方法第1部分:总则

2004-05-28

现行

GB/T 4937.1-2006

半导体器件 机械和气候试验方法 第1部分: 总则
Semiconductor devices―Mechanical and climatic test methods―Part 1: General

2006-08-23

现行

IEC 60749-38-2008

Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
半导体器件 - 机械和气候测试方法 - 第38部分:具有存储器的半导体器件的软错误测试方法

2008-02-12

现行

IEC 62951-1-2017

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
半导体器件 - 柔性和可拉伸半导体器件 - 第1部分:柔性基板上导电薄膜的弯曲试验方法

2017-04-10

现行

KS C IEC 62951-1

반도체소자 — 유연성 및 신축성 반도체소자 — 제1부: 유연성 기판의 전도성 박막에 대한 굽힘 시험방법
半导体器件.柔性和可拉伸半导体器件.第1部分:柔性衬底上导电薄膜的弯曲试验方法

2022-11-22

现行

IEC 62047-37-2020

Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
半导体器件微机电器件第37部分:传感器用MEMS压电薄膜的环境试验方法

2020-04-28

现行

IEC 62047-36-2019

Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
半导体器件微机电器件第36部分:MEMS压电薄膜的环境和介电耐受试验方法

2019-04-05

现行

BS IEC 62047-36-2019

Semiconductor devices. Micro-electromechanical devices-Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
半导体器件 微机电设备

2019-04-24

现行

MIL MIL-STD-883-1

ENVIRONMENTAL TEST METHODS FOR MICROCIRCUITS - PART 1: TEST METHODS 1000-1999
微电路环境试验方法第1部分:试验方法1000-1999

2019-09-16