印制板用铜箔试验方法
Test methods for copper foil used for printed boards

2013-11-12

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for copper foil for use in the manufacture of copper-clad base materials
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 覆铜基材制造用铜箔规范

1990-02-28

Test methods of copper-clad laminates for printed wiring boards
印制线路板用覆铜层压板的试验方法

1996-01-01

Test methods of copper-clad laminates for flexible printed wiring boards
挠性印制线路板用覆铜层压板的试验方法

1995-01-01

印制电路用刚性覆铜箔层压板试验方法
Test methods for rigid copper clad laminates for printed circuits board

2017-05-31

Standard Test Method for Rapid Determination of Corrosiveness to Copper from Petroleum Products Using a Disposable Copper Foil Strip
用一次性铜箔带快速测定石油产品对铜腐蚀性的标准试验方法

2023-10-01

Standard Test Method for Measuring Heat Flux Using a Copper-Constantan Circular Foil, Heat-Flux Transducer
使用铜 - 恒定圆形箔 热通量传感器测量热通量的标准测试方法

2020-11-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
电气材料、印制板和其他互连结构和组件的试验方法

2015-06-30

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Soldering paste using fine solder particles
电气材料、印制板和其他互连结构和组件的试验方法

2021-05-06

Draft Document - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles (IEC 91/1620/CD:2019); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第5-301部分:印制板组件的试验方法——使用细焊料颗粒的焊膏（IEC 91/1620/CD:2019）；德语和英语文本

2020-12-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
电气材料、印制板和其他互连结构和组件的试验方法.第2-721部分:互连结构材料的试验方法.使用分裂柱介质谐振器在微波频率下测量覆铜板的相对介电常数和损耗正切

2015-04-29

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
电气材料、印制板和其他互连结构和组件的试验方法第5-301部分:材料和组件的一般试验方法细焊料的焊膏

2021-03-17

Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Test methods for materials for interconnection structures. Decomposition temperature (T_d) using TGA
电气材料、印制板和其他互连结构和组件的试验方法

2021-11-05

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T_d) using TGA
电气材料、印制板和其他互连结构和组件的试验方法.第2-807部分:互连结构材料的试验方法.使用TGA的分解温度（T_d）

2021-09-03

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015); German version EN 61189-2-721:2015
电气材料、印制板和其他互连结构和组件的试验方法第2-721部分:互连结构材料的试验方法用分裂柱d测量微波频率下覆铜板的相对介电常数和损耗正切

2016-03-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
电气材料的试验方法 印制板和其他互连结构及组件.第5-506部分:材料和组件的一般试验方法.根据IEC 61189-5-501 使用细间距试验结构进行焊剂表面绝缘电阻（SIR）试验的相互比较评估

2019-06-26