现行

VDI 2710

Interdisciplinary design of automated guided vehicle systems (AGVS)
自动引导车辆系统（AGVS）的跨学科设计

2010-04-01

现行

GOST R 58837-2020

Автомобильные транспортные средства. Системы автоматизированного управления. Общие принципы проектирования
机动车辆 自动控制系统 设计通则

现行

JIS D 6802-1997

Automatic guided vehicle systems -- General rules on the safety
自动引导车辆系统安全通用规则

1997-01-01

现行

VDI 2710 Sheet 1

Interdisciplinary design of automated guided vehicle systems (AGVS) - Decision criteria for the choice of a conveyor system
自动引导车辆系统（AGVS）的跨学科设计.输送机系统选择的决策标准

2007-08-01

现行

YC/T 487-2014

自动导引车(AGV)存取烟丝箱式自动化物流系统设计规范
Design specification of automated guided vehicle(AGV) automatic storage and retrieval system for cut tobacco container

2014-03-24

现行

BS EN 60191-6-18-2010

Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
半导体器件的机械标准化

2010-10-31

现行

BS EN 60191-6-1-2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for gull-wing lead terminals
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2002-03-29

现行

BS EN 60191-6-5-2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for fine-pitchball grid array (FBGA)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2001-11-15

现行

IEC 60191-6-18-2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
半导体器件的机械标准化 - 第6-18部分:表面安装半导体器件封装外形图的准备通则 - 球栅阵列（BGA）设计指南

2010-01-07

现行

IEC 60191-6-1-2001

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
半导体器件的机械标准化 - 第6-1部分:表面贴装半导体器件封装外形图的一般规则 - 鸥翼引线端子设计指南

2001-10-30

现行

BS EN 60191-6-8-2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for glass sealed ceramic quad flatpack (G-QFP)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2001-11-16

现行

UNE-EN 60191-6-1-2002

Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals.
半导体器件的机械标准化第6-1部分:表面安装半导体器件封装外形图绘制的一般规则鸥翼引线端子的设计指南

2002-06-28

现行

IEC 60191-6-6-2001

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
半导体器件的机械标准化 - 第6-6部分:表面贴装半导体器件封装外形图准备的一般规则 - 精细间距土地网格阵列（flga）设计指南

2001-03-22

现行

IEC 60191-6-5-2001

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
半导体器件的机械标准化 - 第6-5部分:表面贴装半导体器件封装外形图的一般规则 - 细间距球栅阵列设计指南（fbga）

2001-08-27

现行

BS EN 60191-6-6-2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for fine pitch land grid array (FLGA)-Proposed amendment on terminology
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2001-09-05

现行

UNE-EN 60191-6-5-2002

Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
半导体器件的机械标准化第6-5部分:表面安装半导体器件封装外形图绘制的一般规则细间距球栅阵列（FBGA）设计指南

2002-06-28

现行

UNE-EN 60191-6-6-2002

Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
半导体器件的机械标准化第6-6部分:表面安装半导体器件封装外形图绘制的一般规则细间距栅极阵列（FLGA）设计指南

2002-03-21

现行

IEC 60191-6-8-2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
半导体器件的机械标准化 - 第6-8部分:表面贴装半导体器件封装外形图的一般规则 - 玻璃密封陶瓷四方扁平封装（g-qfp）设计指南

2001-08-27

现行

UNE-EN 60191-6-8-2002

Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
半导体器件的机械标准化第6-8部分:表面安装半导体器件封装外形图绘制的一般规则玻璃密封陶瓷四边形扁平封装（G-QFP）的设计指南

2002-06-28

现行

BS EN 60191-6-2-2002

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则

2003-03-04