现行

BS 6221-6-1982

Printed wiring boards-Specification for multilayer printed wiring boards
印刷线路板 多层印制线路板规范

1982-01-29

现行

BS EN 62326-4-1997

Printed boards-Rigid multilayer printed boards with interlayer connections. Sectional specification
印制板 带有夹层连接的刚性多层印制板 分规范

1997-06-15

现行

JIS C 5014-1994

Multilayer printed wiring boards
多层印制电路板

1994-01-01

现行

BS 6221-11-1991

Printed wiring boards-Specification for flex-rigid multilayer printed boards with through connections
印刷线路板 带贯穿连接的挠性-刚性多层印制板规范

1991-08-30

现行

GB/T 4588.4-2017

刚性多层印制板分规范
Sectional specification for rigid multilayer printed boards

2017-07-31

现行

QJ 831B-2011

航天用多层印制电路板通用规范
General specification for multilayer printed board for aerospace

2011-07-19

现行

IEC 62326-4-1996

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
印刷电路板 - 第4部分:具有层间连接的刚性多层印刷电路板 - 分段规格

1996-12-19

现行

KS C IEC 62326-4(2021 Confirm)

인쇄회로기판－제4부：층간 배선된 경성 다층 인쇄회로기판－부분규격
印制板第4部分:层间连接刚性多层印制板分规范

2011-07-28

现行

KS C IEC 62326-4(2016 Confirm)

인쇄회로기판－제4부：층간 배선된 경성 다층 인쇄회로기판－부분규격
印制板第4部分:层间连接刚性多层印制板分规范

2011-07-28

现行

UNE-EN 62326-4-1999

PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS. SECTIONAL SPECIFICATION.
印制板 第4部分:带夹层连接的刚性多层印制板 分规范

1999-04-19

现行

BS 6221-12-1992

Printed wiring boards-Specification for mass lamination panels (semi-manufactured multilayer printed boards)
印刷线路板 大规模层压板（半成品多层印制板）规范

1992-11-15

现行

GOST IEC 62326-4-2013

Платы печатные. Часть 4. Жесткие многослойные печатные платы с межслойными соединениями. Технические условия
印刷板具有层间连接的刚性多层印刷电路板 剖面规格

2013-11-14

现行

BS 6221-9-1991

Printed wiring boards-Specification for flexible multilayer boards with through connections
印刷线路板 带贯穿连接的挠性多层板规范

1991-09-30

现行

GB/T 18334-2001

有贯穿连接的挠性多层印制板规范
Specification for flexible multilayer printed boards with through conections

2001-03-07

现行

IPC 4101E-WAM1

Specification for Base Materials for Rigid and Multilayer Printed Boards
刚性和多层印制板用基材规范

2020-04-01

现行

QJ 832B-2011

航天用多层印制电路板试验方法
Test method of multilayer printed board for aerospace

2011-07-19

现行

SJ/Z 21299-2018

多层印制板压制指南
Guide of laminating for multilayer printed circuit boards

2018-01-18

现行

GB/T 4588.12-2000

预制内层层压板规范（半制成多层印制板）
Specification for mass laminationpanels (semi-manufactured multilayer printed boards)

2000-12-11

现行

GB/T 18335-2001

有贯穿连接的刚挠多层印制板规范
Specification for flex-rigid multilayer printed boards with through connections

2001-03-07

现行

MIL MIL-PRF-31032B Amendment 1(amendment incorporated)

Printed Circuit Board/Printed Wiring Board, General Specification for
印刷电路板/印刷线路板通用规范

2012-05-16