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现行 IEC 62047-13:2012
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Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures 半导体器件 - 微机电器件 - 第13部分:测量MEMS结构的粘合强度的弯曲和剪切型测试方法
发布日期: 2012-02-28
IEC 62047-13:2012规定了使用试样柱状形状在微型元件和基板之间进行粘合试验的方法。本国际标准适用于宽度和厚度为1μm的基板上制备的微结构的粘合强度测量;分别为1毫米到1毫米。本标准规定了微型元件的粘着测试方法,以优化选择MEMS器件的材料和加工条件。本标准并未特别限制测试件材料、测试件尺寸和测量设备的性能,因为MEMS设备组件的材料和尺寸范围广泛,适用于微型测试机- 尺寸材料尚未普及。
IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively. This standard specifies the adhesive testing method for micro-sized-elements in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized.
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归口单位: TC 47/SC 47F
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