现行

BS EN 62047-13-2012

Semiconductor devices. Micro-electromechanical devices-Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
半导体器件 微机电设备

2012-05-31

现行

BS EN 62047-18-2013

Semiconductor devices. Micro-electromechanical devices-Bend testing methods of thin film materials
半导体器件 微机电设备

2013-10-31

现行

BS IEC 62047-35-2019

Semiconductor devices. Micro-electromechanical devices-Test method of electrical characteristics under bending deformation for flexible electromechanical devices
半导体器件 微机电设备

2021-04-20

现行

IEC 62047-43-2024

Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
半导体器件.微机电器件.第43部分:柔性微机电器件循环弯曲变形后电气特性的试验方法

2024-03-19

现行

IEC 62047-13-2012

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
半导体器件 - 微机电器件 - 第13部分:测量MEMS结构的粘合强度的弯曲和剪切型测试方法

2012-02-28

现行

IEC 62047-18-2013

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
半导体器件 - 微机电器件 - 第18部分:薄膜材料的弯曲测试方法

2013-07-17

现行

KS C IEC 62047-18

반도체 소자 ― 초소형 전기기계소자 ― 제18부: 박막 재료의 굽힘 시험방법
半导体器件 - 微机电装置 - 第18部分:薄膜材料弯曲试验方法

2016-12-29

现行

KS C IEC 62047-22

반도체 소자 ― 초소형 전기기계소자 ― 제22부: 유연 기판의 전도성 박막용 전기기계 인장 시험방법
半导体器件 - 微机电装置 - 第18部分:薄膜材料弯曲试验方法

2016-12-29

现行

KS C IEC 62047-18(2021 Confirm)

반도체 소자 ― 초소형 전기기계소자 ― 제18부: 박막 재료의 굽힘 시험방법
半导体器件微机电器件第18部分:薄膜材料弯曲试验方法

2016-12-29

现行

KS C IEC 62047-22(2021 Confirm)

반도체 소자 ― 초소형 전기기계소자 ― 제22부: 유연 기판의 전도성 박막용 전기기계 인장 시험방법
半导体器件微机电器件第18部分:薄膜材料弯曲试验方法

2016-12-29

现行

BS EN 62047-8-2011

Semiconductor devices. Micro-electromechanical devices-Strip bending test method for tensile property measurement of thin films
半导体器件 微机电设备

2011-06-30

现行

BS 10/30211454 DC

BS EN 62047-13. Semiconductor devices. Micro-electromechanical devices. Part 13. Bend- and shear- test methods of measuring adhesive strength for MEMS structures
英国标准EN 62047-13 半导体器件 微型机电设备 第13部分 测量MEMS结构粘接强度的弯曲和剪切试验方法

2010-02-22

现行

IEC 62047-8-2011

Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
半导体器件 - 微机电器件 - 第8部分:用于薄膜拉伸性能测量的带钢弯曲试验方法

2011-03-14

现行

KS C IEC 62047-8(2020 Confirm)

반도체소자 ― 초소형 전기기계소자 ― 제8부: 박막의 인장 특성 측정을 위한 띠굽힘 시험방법
半导体器件 - 微机电装置 - 第8部分:带弯曲为薄膜的拉伸性能测定的测试方法

2015-12-30

现行

BS IEC 62047-31-2019

Semiconductor devices. Micro-electromechanical devices-Four-point bending test method for interfacial adhesion energy of layered MEMS materials
半导体器件 微机电设备

2019-04-17

现行

IEC 62047-35-2019

Semiconductor devices – Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
半导体器件.微机电装置.第35部分:挠性机电装置弯曲变形电特性的试验方法

2019-11-22

现行

BS EN 62047-25-2016

Semiconductor devices. Micro-electromechanical devices-Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
半导体器件 微机电设备

2016-11-30

现行

IEC 62047-47-2024

Semiconductor devices - Micro-electromechanical devices - Part 47: Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures
半导体器件.微机电器件.第47部分:硅基MEMS制造技术.微结构弯曲强度的测量方法

2024-08-23

现行

IEC 62047-25-2016

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
半导体器件 - 微机电器件 - 第25部分:硅基存储器制造技术 - 微接合区域的拉压和剪切强度测量方法

2016-08-29

现行

IEC 62047-31-2019

Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
半导体器件微机电器件第31部分:层状MEMS材料界面结合能的四点弯曲试验方法

2019-04-05